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dc.contributor.authorZhang, J
dc.contributor.authorLiu, W
dc.contributor.authorTennant, A
dc.contributor.authorQi, W
dc.contributor.authorChen, J
dc.contributor.authorZhang, J
dc.date.accessioned2023-10-17T15:05:13Z
dc.date.available2023-10-17T15:05:13Z
dc.date.issued2023
dc.identifier.issn2473-2400
dc.identifier.urihttps://qmro.qmul.ac.uk/xmlui/handle/123456789/91385
dc.description.abstractIn this paper, a multipath component aggregation (MCA) mechanism is introduced for spatial scattering modulation (SSM) to overcome the limitation in conventional SSM that the transmit antenna array steers the beam to a single multipath (MP) component at each instance. In the proposed MCA-SSM system, information bits are divided into two streams. One is mapped to an amplitude-phase-modulation (APM) constellation symbol, and the other is mapped to a beam vector symbol which steers multiple beams to selected strongest MP components via an MCA matrix. In comparison with the conventional SSM system, the proposed MCA-SSM enhances the bit error performance by avoiding both low receiving power due to steering the beam to a single weak MP component and inter-MP interference due to MP components with close values of angle of arrival (AoA) or angle of departure (AoD). For the proposed MCA-SSM, a union upper bound (UUB) on the average bit error probability (ABEP) with any MCA matrix is analytically derived and validated via Monte Carlo simulations. Based on the UUB, the MCA matrix is analytically optimized to minimize the ABEP of the MCA-SSM. Finally, numerical experiments are carried out, which show that the proposed MCA-SSM system remarkably outperforms the state-of-the-art SSM system in terms of ABEP under a typical indoor environment.en_US
dc.format.extent1 - 1
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en_US
dc.relation.ispartofIEEE Transactions on Green Communications and Networking
dc.titleSpatial Scattering Modulation With Multipath Component Aggregationen_US
dc.typeArticleen_US
dc.rights.holder© 2023 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
dc.identifier.doi10.1109/tgcn.2023.3315247
pubs.issue99en_US
pubs.notesNot knownen_US
pubs.volumePPen_US
rioxxterms.funderDefault funderen_US
rioxxterms.identifier.projectDefault projecten_US


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