dc.contributor.author | Lu, T | en_US |
dc.contributor.author | Liu, T | en_US |
dc.contributor.author | Deng, Z | en_US |
dc.date.accessioned | 2022-10-06T09:54:56Z | |
dc.date.issued | 2008 | en_US |
dc.identifier.issn | 1006-9321 | en_US |
dc.identifier.uri | https://qmro.qmul.ac.uk/xmlui/handle/123456789/81399 | |
dc.format.extent | 2059 - 2074 | en_US |
dc.relation.ispartof | SCIENCE IN CHINA SERIES E-TECHNOLOGICAL SCIENCES | en_US |
dc.subject | sandwich panel | en_US |
dc.subject | pin reinforcement | en_US |
dc.subject | analytical solutions | en_US |
dc.subject | homogenization thermoelasticity | en_US |
dc.subject | thermal expansion | en_US |
dc.title | Thermoelastic properties of sandwich materials with pin-reinforced foam cores | en_US |
dc.type | Article | |
dc.rights.holder | © 2008 Springer Nature Switzerland AG. Part of Springer Nature. | |
dc.identifier.doi | 10.1007/s11431-008-0226-2 | en_US |
pubs.author-url | https://www.webofscience.com/api/gateway?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000261607500001&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=612ae0d773dcbdba3046f6df545e9f6a | en_US |
pubs.issue | 12 | en_US |
pubs.notes | Not known | en_US |
pubs.publication-status | Published | en_US |
pubs.volume | 51 | en_US |
rioxxterms.funder | Default funder | en_US |
rioxxterms.identifier.project | Default project | en_US |