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Low Temperature Scalable Deposition of Copper(I) Thiocyanate Films via Aerosol-Assisted Chemical Vapor Deposition

dc.contributor.authorMohan, Len_US
dc.contributor.authorRatnasingham, SRen_US
dc.contributor.authorPanidi, Jen_US
dc.contributor.authorAnthopoulos, TDen_US
dc.contributor.authorBinions, Ren_US
dc.contributor.authorMcLachlan, MAen_US
dc.contributor.authorBriscoe, Jen_US
dc.date.accessioned2020-08-10T10:57:06Z
dc.date.issued2020-08-05en_US
dc.identifier.issn1528-7483en_US
dc.identifier.urihttps://qmro.qmul.ac.uk/xmlui/handle/123456789/66149
dc.format.extent5380 - 5386en_US
dc.relation.ispartofCRYSTAL GROWTH & DESIGNen_US
dc.rightsThis is a pre-copyedited, author-produced version of an article accepted for publication in Crystal Growth & Design following peer review. The version of record is available https://pubs.acs.org/doi/10.1021/acs.cgd.0c00605
dc.titleLow Temperature Scalable Deposition of Copper(I) Thiocyanate Films via Aerosol-Assisted Chemical Vapor Depositionen_US
dc.typeArticle
dc.rights.holder© 2020 American Chemical Society
dc.identifier.doi10.1021/acs.cgd.0c00605en_US
pubs.author-urlhttp://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000558791100055&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=612ae0d773dcbdba3046f6df545e9f6aen_US
pubs.issue8en_US
pubs.notesNot knownen_US
pubs.publication-statusPublisheden_US
pubs.volume20en_US
rioxxterms.funderDefault funderen_US
rioxxterms.identifier.projectDefault projecten_US


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