Torsional stress relaxation behavior of microscale copper wire
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Volume
698
Pagination
277 - 281
DOI
10.1016/j.msea.2017.05.044
Journal
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN
0921-5093
Metadata
Show full item recordAuthors
Guo, S; He, Y; Liu, D; Lei, J; Li, Z; Ding, HCollections
- Physics and Astronomy [1283]